| 杨喜存,单军勇.某机载站控制分系统温度循环试验凝露积水问题[J].装备环境工程,2013,10(2):93-95. YANG Xi-cun,SHAN Jun-yong.Solution to Waterproof Problem of Moisture Deposition in Temperature Cycle Test[J].Equipment Environmental Engineering,2013,10(2):93-95. |
| 某机载站控制分系统温度循环试验凝露积水问题 |
| Solution to Waterproof Problem of Moisture Deposition in Temperature Cycle Test |
| 投稿时间：2012-10-13 修订日期：2013-03-01 |
| DOI： |
| 中文关键词: 温度循环试验 控制分系统 模块 凝露积水 失效分析 |
| 英文关键词:temperature cycle test control subsystem components water logging failure analysis |
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| 中文摘要: |
| 电子产品在温度循环试验中未采取防凝露积水措施或方法不当，使试验箱体内的水分堆积在某机载站控制系统微电机驱动板上，导致驱动板上的模块A出现漏电和短路，试件性能异常，系统故障发生。通过对该控制分系统温度循环试验中失效模块A的分析，得出失效原因为试验中防凝露积水方法不当，可有针对性地对温度循环试验中防凝露积水进行改善。 |
| 英文摘要: |
| If anti-waterlogging measures of ordnance electronic products are not taken in temperature cycle test, or if it is taken improperly, water vapor of test box will condense on the components of the subsystem. Thus, the components will have a leakage of electricity and abnormal performance, which will make the whole system failure. The failure components in the subsystem temperature shock test were analyzed. The causes of failure anti-condensation measures were put forward. A solution to the protection measures of anti-condensation in the temperature shock test was provided. |
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