| 朱广滕,顾晓辉,方道红,肖坤.电子部件失效模式试验与仿真研究[J].装备环境工程,2013,10(6):45-49. ZHU Guang-teng,GU Xiao-hui,FANG Dao-hong,XIAO Kun.Electronic Components Failure Mode Test and Simulation Study[J].Equipment Environmental Engineering,2013,10(6):45-49. |
| 电子部件失效模式试验与仿真研究 |
| Electronic Components Failure Mode Test and Simulation Study |
| 投稿时间：2013-09-12 修订日期：2013-10-25 |
| DOI：10.7643/issn.1672-9242.2013.06.011 |
| 中文关键词: 电子部件 失效模式 蠕变 有限元仿真 |
| 英文关键词:electronic components failure mode creep FEM |
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| 中文摘要: |
| 目的 研究焊点在热应力下的等效应力和等效蠕性应变。方法 通过测定某子弹电子部件的工作极限温度、破坏极限温度，利用阶梯变化的温度来验证电子部件的极限适应温度，找出电子部件的主要失效模式。通过有限元仿真来模拟热载荷作用下焊点的应力应变行为。结果应用Garofalo模型仿真得出的蠕变效应与实际试验结果基本相近。结论 通过仿真方法 与试验结果相对比，证明使用Garofalo模型来研究电子部件焊点的蠕变效应是可行的。 |
| 英文摘要: |
| Objective To investigate the equivalent stress and equivalent creep strain of lead-free solder joints under thermal stress.Methods The ultimate adaptive temperature of the electronic components was verified through staircase pattern increased temperature. The ultimate working temperature and damaging temperature of the electronic components were tested, and the main failure mode of electronic components was obtained. Subsequently, the stress and strain of solder behavior was simulated by FEM. ResultsThe simulation results were corresponded with the experimental results.Conclusion Our results provided reliable evidence on how to control the solder joint shape and proved that the Garofalo method is feasible to improve the electronic components’life period. |
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