| 黄萃豪,黄萃名,郑玉文.电子元器件表面化学防护效果的测定研究[J].装备环境工程,2014,11(1):45-47,53. HUANG Cui-hao,HUANG Cui-min,ZHENG Yu-wen.Study on the Determination of Electronic Components Surface Chemical Protective Effect[J].Equipment Environmental Engineering,2014,11(1):45-47,53. |
| 电子元器件表面化学防护效果的测定研究 |
| Study on the Determination of Electronic Components Surface Chemical Protective Effect |
| 投稿时间：2013-08-02 修订日期：2014-01-09 |
| DOI：10.7643/issn.1672-9242.2014.01.009 |
| 中文关键词: 电子元器件表面化学防护 印制板涂层 抗恶劣环境 |
| 英文关键词:chemical protection of components surface printed circuit board coating resistance to harsh environment |
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| 中文摘要: |
| 目的研究电子元器件表面化学防护的方法。方法应用选择性涂覆设备进行研究并优化工艺条件，选择丙烯酸清漆和稀释剂的体积混合比例从1∶0.2到1∶1进行实验，在100mm/s的喷涂速度下，喷涂印制板的过程在0.5min内完成，喷涂的相对标准偏差不超过±0.005mm。结果涂层厚度可控制在25～75μm的范围内，符合国际标准ICP-CC-830的要求，涂层具有较好的流平性，无气泡、针孔和絮状物，无雾化等。结论这种方法可以成功地应用于印制板上电子元器件表面的化学防护。该方法具有涂覆准确性高，有毒稀释剂消耗量低，涂覆效果好，经济环保等的特点。 |
| 英文摘要: |
| ObjectiveTo study the method of surface chemical protection of electronic components.MethodsUsing conformal coating equipment to research and optimization of the process conditions. Mixing ratio of acrylic varnish and diluent were from1:0.2to 1:1，at the dispense speed of100mm s-1，a complete process could be performed within0.5 minute，with a relative standard deviation of less than ±0.005mm.ResultsThe coating thickness can be controlled in the range of25-75um，consistent with the requirements of international standard ICP-CC-830，the coating has good leveling property，no bubbles，pinhole and floc，no atomization.ConclusionThis method can be successfully applied to the surface chemical protection of electronic components on the printed circuit board. The method has high accuracy，low consumption of toxic diluent，good coating effect，economy and environmental protection etc. characteristics. |
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