| 王春晖,邱述斌.可靠性鉴定试验受试样品的软硬件联合测试技术[J].装备环境工程,2014,11(2):64-68. WANG Chun-hui,QIU Shu-bin.Study on Hardware-software Join Test Technology for Reliability Qualification Test[J].Equipment Environmental Engineering,2014,11(2):64-68. |
| 可靠性鉴定试验受试样品的软硬件联合测试技术 |
| Study on Hardware-software Join Test Technology for Reliability Qualification Test |
| 投稿时间：2013-12-09 修订日期：2014-01-17 |
| DOI：10.7643/issn.1672-9242.2014.02.012 |
| 中文关键词: 可靠性试验 硬件与软件 联合测试 立体测试 环境剖面 |
| 英文关键词:reliability test hardware and software joint testing three-dimensional test environment profile |
| 基金项目: |
|
|
|
|
| 摘要点击次数: |
| 全文下载次数: |
| 中文摘要: |
| 为了研究一种可靠性鉴定试验中受试样品的软硬件联合测试方法，首先总结了软硬件联合测试的目的、对象、实施时机及传统测试需要的改进之处和可借鉴之处，进一步研究了软硬件联合测试与传统可靠性试验的关系。然后在考查软件与硬件测试结合的基础上，提出了两层结构立体测试运行剖面的方法，即利用子剖面与环境剖面的对应关系建立软件测试与硬件测试的联系，将两种测试统一在同一时间轴上，得出了软硬件联合测试的一般流程。 |
| 英文摘要: |
| Reliability test is an important means for ensuring the product quality. With the increasing application of embedded software，hardware and software interface has become increasingly blurred，software and hardware failures affect each other，but at present，there is no systematic test theory of hardware and software，and also no mature hardware and software jointly testing techniques or processes. To address this problem，first，this paper summarized the traditional testing which needs to be improved and can learn lessons from，on the basis of examining a combination of software and hardware testing，a two-tier structure of three-dimensional test running profile was proposed. The connection of hardware testing and software testing was built according to the corresponding relation between Sub-profile and the environment profile，and the two testings were then united in the same timeline, achieving the general process of Hardware-Software Co-Test. |
| 查看全文 查看/发表评论 下载PDF阅读器 |
| 关闭 |
