| 胡芳友,余周辉,何西常,赵培仲.有机硅改性环氧树脂的光固化动力学与性能研究[J].装备环境工程,2018,15(2):8-13. HU Fang-you,YU Zhou-hui,HE Xi-chang,ZHAO Pei-zhong.UV Curing Kinetics and Performance of Organic Silicon Modified Epoxy Resin[J].Equipment Environmental Engineering,2018,15(2):8-13. |
| 有机硅改性环氧树脂的光固化动力学与性能研究 |
| UV Curing Kinetics and Performance of Organic Silicon Modified Epoxy Resin |
| 投稿时间：2017-11-14 修订日期：2018-02-15 |
| DOI：10.7643/ issn.1672-9242.2018.02.002 |
| 中文关键词: 紫外光固化 环氧树脂 有机硅 介电分析 |
| 英文关键词:UV curing epoxy resin organic silicon dielectric analysis |
| 基金项目: |
|
|
| Author | Institution |
| HU Fang-you | Department of Aeronautical and Mechanical Engineering, Qingdao Branch, Naval Academy of Aeronautical Engineering, Qingdao 266041, China |
| YU Zhou-hui | Department of Aeronautical and Mechanical Engineering, Qingdao Branch, Naval Academy of Aeronautical Engineering, Qingdao 266041, China |
| HE Xi-chang | Army Engineering University, Xuzhou 221004, China |
| ZHAO Pei-zhong | Department of Aeronautical and Mechanical Engineering, Qingdao Branch, Naval Academy of Aeronautical Engineering, Qingdao 266041, China |
|
| 摘要点击次数: |
| 全文下载次数: |
| 中文摘要: |
| 目的 研究紫外光固化有机硅改性环氧树脂的固化行为和性能。方法 通过介电分析（DEA）研究光引发剂、热引发剂及有机硅含量对紫外光固化脂环族环氧树脂反应过程的影响，利用热重（TG）、差示扫描热（DSC）和显微硬度仪对有机硅树脂改性环氧树脂性能进行分析。结果 发现光引发剂与热引发剂对固化效率可起到协同互补的作用，增加光引发剂和热引发剂的浓度，可缩短引发时间，加快固化速率，提高固化效率。与纯环氧树脂相比，有机硅改性环氧树脂的固化效率和初始分解温度都有所下降，但高温阶段降解速率明显降低，500 ℃的残炭率也得到提高。当加入质量分数为10%的有机硅时，固化物表现出较好的耐热性能，树脂维氏硬度可达31.75HV。结论 紫外光可以很好地固化有机硅改性环氧树脂。 |
| 英文摘要: |
| Objective To study curing behaviors and properties of UV cured organic silicone modified epoxy resin. Methods The effects of amount of photo/thermal initiator, organic silicon on UV curing process of cycloaliphatic epoxy acrylate were studied by dielectric analysis (DEA). The property of organic silicon modified epoxy resin was analyzed by TG, DSC and microhardness tester. Results Photo/thermal initiator had the effect of cooperative complementary on curing effect. Increasing the amount of photo/thermal initiator could shortened the initiation time, speeded up the curing rate and improved the efficiency of curing. Compared with pure epoxy resin, curing efficiency and initial decomposition temperature of silicon modified epoxy resin decreased while decomposition rate decreased in high temperature and the char yield was also improved at 500℃. With the addition of 10% organic silicon content, cured films showed good resistance and the Vickers hardness of the resin could reach 37.15HV. Conclusion UV light can effectively cure the modified epoxy resin. |
| 查看全文 查看/发表评论 下载PDF阅读器 |
| 关闭 |
|
|
|
