申海东,张泽,陈科雯,欧永.基于双热阻模型的典型芯片封装热分析及评估方法[J].装备环境工程,2018,15(7):10-14. SHEN Hai-dong,ZHANG Ze,CHEN Ke-wen,OU Yong.Thermal Analysis and Evaluation Method of Typical Chip Package Based on Double Thermal Resistance Model[J].Equipment Environmental Engineering,2018,15(7):10-14.
基于双热阻模型的典型芯片封装热分析及评估方法
Thermal Analysis and Evaluation Method of Typical Chip Package Based on Double Thermal Resistance Model
投稿时间:2018-04-27  修订日期:2018-07-25
DOI:10.7643/ issn.1672-9242.2018.07.003
中文关键词:  芯片  双热阻  热分析  封装
英文关键词:chip  double thermal resistance  thermal analysis  package
基金项目:装备环境适应性公共服务平台(TC150B5C0/41);国家电子信息产品可靠性与环境工程技术研究中心培育(2017B090903006)
作者单位
申海东 1. 工业和信息化部电子第五研究所,广州 510610; 2. 广东省电子信息产品可靠性技术重点实验室,广州 510610; 3. 电子信息产品可靠性分析与测试技术国家地方联合工程中心,广州 510610; 4. 广东省智能机器人可靠性工程技术研究中心,广州 510610 
张泽 1. 工业和信息化部电子第五研究所,广州 510610; 2. 广东省电子信息产品可靠性技术重点实验室,广州 510610; 3. 电子信息产品可靠性分析与测试技术国家地方联合工程中心,广州 510610; 4. 广东省智能机器人可靠性工程技术研究中心,广州 510610 
陈科雯 1. 工业和信息化部电子第五研究所,广州 510610; 2. 广东省电子信息产品可靠性技术重点实验室,广州 510610; 3. 电子信息产品可靠性分析与测试技术国家地方联合工程中心,广州 510610; 4. 广东省智能机器人可靠性工程技术研究中心,广州 510610 
欧永 5. 泰州赛宝工业技术研究院有限公司,江苏 泰州 225500 
AuthorInstitution
SHEN Hai-dong 1.CEPREI, Guangzhou 510610, China; 2. Guangdong Provincial Key Laboratory of Electronic Information Products Reliability Technology, Guangzhou 510610, China; 3. National Joint Engineering Center of Reliability Analysis and Testing Technology of Electronic Information Products, Guangzhou 510610, China; 4. Guangdong intelligent robot Reliability Engineering Technology Research Center, Guangzhou 510610, China 
ZHANG Ze 1.CEPREI, Guangzhou 510610, China; 2. Guangdong Provincial Key Laboratory of Electronic Information Products Reliability Technology, Guangzhou 510610, China; 3. National Joint Engineering Center of Reliability Analysis and Testing Technology of Electronic Information Products, Guangzhou 510610, China; 4. Guangdong intelligent robot Reliability Engineering Technology Research Center, Guangzhou 510610, China 
CHEN Ke-wen 1.CEPREI, Guangzhou 510610, China; 2. Guangdong Provincial Key Laboratory of Electronic Information Products Reliability Technology, Guangzhou 510610, China; 3. National Joint Engineering Center of Reliability Analysis and Testing Technology of Electronic Information Products, Guangzhou 510610, China; 4. Guangdong intelligent robot Reliability Engineering Technology Research Center, Guangzhou 510610, China 
OU Yong 5. CEPREI Laboratory (Taizhou), Taizhou 225500, China 
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中文摘要:
      目的 研究基于双热阻模型的芯片封装热分析及评估方法,并对比分析芯片封装不同建模方式对热分析结果的影响。方法 采用双热阻模型建立某 ECU 产品的芯片封装模型,并与“集总参数法”建模法的计算结果进行对比分析与评价。根据案例中典型的实测环境(试验箱),建立等效环境模型,并进行对比分析。 结果 采用双热阻模型建模的器件热仿真结果更精确,且能较好地反映芯片封装的实际热分布,从而便于发现芯片散热措施的热设计缺陷。集总参数法在应用与芯片封装建模分析时,计算误差相对较大,且无法准确表现芯片的实际散热情况。另一方面,是否建立实测环境的等效模型对计算结果影响较大。结论 双热阻模型能较好地适用于芯片封装简化建模,在应用于封装芯片热分析时具有更高的精确度,且参数获取难度不大,具备较大的工程应用价值。
英文摘要:
      Objective To study thermal analysis and evaluation method of chip packaging based on double thermal resistance model, compare and analyze influences of different modeling methods on thermal analysis results. Methods The double thermal resistance model was used to establish a chip package model of ECU product and compare with calculation results of the "lumped parameter method" modeling method. An equivalent environment model was established according to the typical measured environment in this case, and the comparative analysis was carried out. Results The thermal simulation results of the device modeled by the double thermal resistance model were more accurate, and it could better reflect the actual thermal distribution of the chip package, thus it was easy to find the thermal design defects of the chip's heat dissipation measures. When the lumped parameter method was applied for modeling and analysis of chip package, the calculation error was relatively large, and the actual heat dissipation of the chip could not be accurately represented. On the other hand, the establishment of equivalent model of measured environment had great influence on the calculation results. Conclusion The double thermal resistance model can be better suitable for the simplified modeling of chip packaging. It has higher accuracy in the application of chip thermal analysis, and it is not difficult to obtain the parameters, so it has great engineering application value.
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