目的 针对实验室设计状态与实际服役环境的系统性差异问题,构建一套面向服役环境的失效机理分析与试验验证方法,支撑电子器部件在复杂服役环境下的可靠性分析与改进。方法 将服役环境划分为长期作用、极限应力、复杂电磁与多场耦合4类,明确其定义与内涵。基于寿命剖面分解与环境应力传递分析,建立电子器部件服役环境模型,并通过产品实现过程分解结构化识别其薄弱环节,进一步建立内外部交互作用的失效机理分析逻辑链,实现失效机理系统推演。针对4类服役环境分别设计应力加速、应力激发、电磁干扰及复合环境4类验证试验方法,形成“环境-失效-验证”的闭环。结果 选取5类典型电子器部件开展应用验证,揭示并验证了其关键薄弱实体在典型服役环境下的主要失效机理,包括热-力耦合疲劳、界面分层、热电子退化等。结论 所提方法可有效支撑电子器部件可靠性分析与改进,为新型装备环境适应性设计与验证提供系统化方法参考。
Abstract
To address the systematic discrepancy between laboratory design conditions and actual service environments, the work aims to develop a comprehensive approach of failure mechanism analysis and experimental verification for service environments, to support the reliability analysis and improvement of electronic components in complex service environments. Service environments were categorized into four types of long-term stress, extreme stress, complex electromagnetic, and multi-field coupling, with their respective definitions and connotations clearly established. A service environment model for electronic components was constructed through life profile decomposition and environmental stress transfer analysis. Weak links were systematically identified via product realization process decomposition, and a logical chain for failure mechanism analysis incorporating internal and external interactions was established to enable systematic deduction. Correspondingly, four verification test methods, including stress acceleration, stress excitation, electromagnetic interference, and combined environment testing were designed to form a closed “environment-failure-verification” loop. The proposed approach was applied to five typical types of electronic components, which revealed and verified dominant failure mechanisms of critical vulnerable entities, including thermo-mechanical coupled fatigue, interface delamination, and hot electron degradation. This approach provides effective support for the reliability analysis and improvement of electronic components and offers a systematic reference for the environmental adaptability design and verification of next-generation equipment.
关键词
电子器部件 /
服役环境 /
薄弱环节 /
环境效应 /
失效机理 /
试验验证
Key words
electronic components /
service environment /
weak links /
environmental effects /
failure mechanism /
experimental verification
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