Failure Mechanism Analysis and Experimental Verification of Electronic Components in Service Environments

ZHU Yao; ZHANG Shengpeng; HAN Xiao; ZHANG Anqi

doi:10.7643/issn.1672-9242.2026.03.012

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Equipment Environmental Engineering ›› 2026, Vol. 23 ›› Issue (3) : 107-119. DOI: 10.7643/issn.1672-9242.2026.03.012

Special Issue—Equipment Service Environment and Performance Testing

Failure Mechanism Analysis and Experimental Verification of Electronic Components in Service Environments

ZHU Yao, ZHANG Shengpeng, HAN Xiao, ZHANG Anqi

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Abstract

To address the systematic discrepancy between laboratory design conditions and actual service environments, the work aims to develop a comprehensive approach of failure mechanism analysis and experimental verification for service environments, to support the reliability analysis and improvement of electronic components in complex service environments. Service environments were categorized into four types of long-term stress, extreme stress, complex electromagnetic, and multi-field coupling, with their respective definitions and connotations clearly established. A service environment model for electronic components was constructed through life profile decomposition and environmental stress transfer analysis. Weak links were systematically identified via product realization process decomposition, and a logical chain for failure mechanism analysis incorporating internal and external interactions was established to enable systematic deduction. Correspondingly, four verification test methods, including stress acceleration, stress excitation, electromagnetic interference, and combined environment testing were designed to form a closed “environment-failure-verification” loop. The proposed approach was applied to five typical types of electronic components, which revealed and verified dominant failure mechanisms of critical vulnerable entities, including thermo-mechanical coupled fatigue, interface delamination, and hot electron degradation. This approach provides effective support for the reliability analysis and improvement of electronic components and offers a systematic reference for the environmental adaptability design and verification of next-generation equipment.

Key words

electronic components / service environment / weak links / environmental effects / failure mechanism / experimental verification

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ZHU Yao, ZHANG Shengpeng, HAN Xiao, ZHANG Anqi. Failure Mechanism Analysis and Experimental Verification of Electronic Components in Service Environments[J]. Equipment Environmental Engineering. 2026, 23(3): 107-119 https://doi.org/10.7643/issn.1672-9242.2026.03.012

References

[1] KOLIAS N J, WHELAN C S, KAZIOR T E, et al.GaN Technology for Microwave and Millimeter Wave Applications[C]// 2010 IEEE MTT-S International Microwave Symposium. Anaheim: IEEE, 2010.
[2] 傅耘, 陈雪晴, 李敏伟, 等. 从1986到2023: 我国军用装备环境试验标准的三级跨越[J]. 装备环境工程, 2025, 22(8): 158-163.
FU Y, CHEN X Q, LI M W, et al.From 1986 to 2023: Three-Level Leaps of Environmental Testing Standards for Military Equipment in China[J]. Equipment Environmental Engineering, 2025, 22(8): 158-163.
[3] 中国人民解放军总装备部. 军用装备实验室环境试验方法: GJB 150A—2009[S]. 北京: 总装备部军标出版发行部, 2009.
The Chinese People's Liberation Army General Armaments Department. Laboratory Environmental Test Methods for Military Materiel: GJB 150A—2009[S]. Beijing: The Chinese People's Liberation Army General Armaments Department Military Standard Publication Distribution Department, 2009.
[4] US Department of Defense. Environmental Engineering Considerations and Laboratory Tests: MIL-STD-810H[S]. Washington: US Department of Defense, 2019.
[5] International Electrotechnical Commission.Environmental Testing: IEC 60068: 2013[S]. Geneva: International Electrotechnical Commission, 2013.
[6] KHANNA V K.Extreme-Temperature and Harsh-Environment Electronics: Physics, Technology and Applications[M]. Bristol: IOP Publishing, 2023.
[7] LEITNER J, SOOD B.Assurance of Electronic Parts for Aerospace System Reliability: Past, Present, and Future[J]. Quality Engineering, 2022, 34(2): 159-175.
[8] DEPIVER J A, MALLIK S, HARMANTO D.Solder Joint Failures under Thermo-Mechanical Loading Conditions— A Review[J]. Advances in Materials and Processing Technologies, 2021, 7(1): 1-26.
[9] AMBAT R, PIOTROWSKA K.Humidity and Electronics: Corrosion Reliability Issues and Preventive Measures[C]// Corrosion Protection of Metals and Alloys. [s. l.]: IntechOpen, 2021: 1-24.
[10] MUSTAQ BASHA S M, WARE N R. Design Validation and Reliability Assurance of Electronic Systems Using Arrhenius Accelerated Growth Test Models[C]// Proceedings of International Conference on Reliability, Safety and Hazard. Singapore: Springer, 2020.
[11] INDMESKINE F E, SAINTIS L, KOBI A.Review on Accelerated Life Testing Plan to Develop Predictive Reliability Models for Electronic Components Based on Design-of-Experiments[J]. Quality and Reliability Engineering International, 2023, 39(6): 2594-2607.
[12] KUMAR S, ZHANG H, LI X.Integrating Real-Time Data and FMEA for Improving Reliability of Electronics in High-Temperature Environments[J]. IEEE Transactions on Reliability, 2020, 69(4): 847-859.
[13] SINGH K, KALRA S.Reliability Forecasting and Accelerated Lifetime Testing in Advanced CMOS Technologies[J]. Microelectronics Reliability, 2023, 151: 115261.
[14] 张伦武, 周堃, 赵方超, 等. 装备环境适应性研究进展及展望[J]. 装备环境工程, 2024, 21(5): 1-12.
ZHANG L W, ZHOU K, ZHAO F C, et al.Research Progress and Prospect of Materiel Environmental Worthiness[J]. Equipment Environmental Engineering, 2024, 21(5): 1-12.
[15] 宣卫芳, 张伦武, 朱蕾, 等. 武器装备环境适应性要求[J]. 装备环境工程, 2018, 15(8): 69-72.
XUAN W F, ZHANG L W, ZHU L, et al.Environmental Adaptability Requirements for Weapons and Equipment[J]. Equipment Environmental Engineering, 2018, 15(8): 69-72.
[16] LANG F Y, ZHOU Z R, LIU J, et al.Review on the Impact of Marine Environment on the Reliability of Electronic Packaging Materials[J]. Frontiers in Materials, 2025, 12: 1584349.
[17] YANG Z B, WANG W Y, WANG B, et al.Environment Adaptability Study of Aerospace CSOP Devices[C]//2025 4th International Conference on Electronics, Integrated Circuits and Communication Technology (EICCT). Chengdu, China. IEEE, 2025: 525-529.
[18] 祝曙光, 孙则鸣, 吉雯龙, 等. 面向联合作战的战场环境知识图谱技术[J]. 国防科技, 2025, 46(2): 121-129.
ZHU S G, SUN Z M, JI W L, et al.Knowledge Graph Technology of Battlefield Environment for Joint Operations[J]. National Defense Science & Technology, 2025, 46(2): 121-129.
[19] 刘晓娣, 李田科, 韩建立. 基于贮存剖面的弹上电子部件可靠性分析[J]. 装备环境工程, 2024, 21(5): 82-87.
LIU X D, LI T K, HAN J L.Reliability Analysis of Missile-Borne Electronic Components Based on Storage Profile[J]. Equipment Environmental Engineering, 2024, 21(5): 82-87.
[20] 赵东, 裴文利, 郁大照, 等. 海洋环境下机载电连接器腐蚀分析与失效机理[J]. 海军航空大学学报, 2022, 37(6): 429-436.
ZHAO D, PEI W L, YU D Z, et al.Corrosion Analysis and Failure Mechanism of Airborne Electrical Connectors in Marine Environment[J]. Journal of Naval Aviation University, 2022, 37(6): 429-436.
[21] CHEN J, FANG Z, HUANG K B, et al.Electromagnetic Pulse Damage Study of Low-Noise Amplifier Module for Navigation Receiver Front-End[C]// 2024 International Conference on Intelligent Communication, Sensing and Electromagnetics (ICSE). Guangzhou: IEEE, 2025.
[22] 中央军委装备发展部. 装备通用质量特性术语: GJB 451B—2021[S]. 北京: 国家军用标准出版发行部, 2022.
Equipment Development Department of the Central Military Commission. General Quality Characteristics Terms for Materiel: GJB 451B—2021[S]. Beijing: National Military Standards Press and Distribution Center, 2022.
[23] 国家市场监督管理总局, 国家标准化管理委员会. 一次成功矩阵式质量管理模式: GB/T 38355—2019[S]. 北京: 中国标准出版社, 2020.
State Administration for Market Regulation, Standardization Administration of the People's Republic of China. Matrix Quality Management Mode for Success Right the First Time: GB/T 38355—2019[S]. Beijing: Standards Press of China, 2020.