夏丽娇,李小岩.SMT-PGA封装焊点热疲劳寿命预计模型研究[J].装备环境工程,2017,14(1):21-23. XIA Li-jiao,LI Xiao-yan.Thermal Fatigue Life Predication Model of Solder Joints for SMT-PGA Package[J].Equipment Environmental Engineering,2017,14(1):21-23.
SMT-PGA封装焊点热疲劳寿命预计模型研究
Thermal Fatigue Life Predication Model of Solder Joints for SMT-PGA Package
投稿时间:2016-08-30  修订日期:2017-01-15
DOI:10.7643/ issn.1672-9242.2017.01.006
中文关键词:  热疲劳  SMT-PGA封装  焊点  工程因子F
英文关键词:thermal fatigue  SMT-PGA package  solder joint  engineering factor F
基金项目:
作者单位
夏丽娇 中国信息通信研究院,北京 100191 
李小岩 中国航空综合技术研究所,北京 100191 
AuthorInstitution
XIA Li-jiao China Academy of Information and Communication Technology, Beijing 100191, China 
LI Xiao-yan China Aero-Polytechnology Establishment, Beijing 100191, China 
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中文摘要:
      目的 研究SMT-PGA封装焊点热疲劳寿命预计模型。方法 运用Engelmaier模型预测SMT-PGA封装焊点的热疲劳寿命,并将Engelmaier模型计算结果与美国马里兰大学CALCE PWA寿命评估软件仿真结果作对比。结果 模型计算结果与马里兰大学寿命评估软件仿真结果存在较大差异。结论 表明Engelmaier模型中的工程因子F并不是一个固定常数,而是受封装最低稳态温度的影响。
英文摘要:
      Objective To study the thermal fatigue life prediction model of solder joints for SMT-PGA package. Methods The thermal fatigue life of SMT-BGA package solder joints was predicted based on the Engelmaier model; and then it was compared with simulation results of CALCE PWA life assessment software of University of Maryland. Results The calculated results were quite different from the simulation results of CALCE PWA software. Conclusion Engineering factor F in the Engelmaier model is not a fixed constant but affected by the minimum steady state temperature of package.
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