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| Study on Hardware-software Join Test Technology for Reliability Qualification Test |
| Received:December 09, 2013 Revised:January 17, 2014 |
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| DOI：10.7643/issn.1672-9242.2014.02.012 |
| KeyWord:reliability test hardware and software joint testing three-dimensional test environment profile |
| Author | Institution |
| WANG Chun-hui |
The Plane Office of Navy Arming Department，Beijing，China |
| QIU Shu-bin |
The Plane Office of Navy Arming Department，Beijing，China |
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| Abstract: |
| Reliability test is an important means for ensuring the product quality. With the increasing application of embedded software，hardware and software interface has become increasingly blurred，software and hardware failures affect each other，but at present，there is no systematic test theory of hardware and software，and also no mature hardware and software jointly testing techniques or processes. To address this problem，first，this paper summarized the traditional testing which needs to be improved and can learn lessons from，on the basis of examining a combination of software and hardware testing，a two-tier structure of three-dimensional test running profile was proposed. The connection of hardware testing and software testing was built according to the corresponding relation between Sub-profile and the environment profile，and the two testings were then united in the same timeline, achieving the general process of Hardware-Software Co-Test. |
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