Degradation Behavior of Copper Metallized Aluminum Nitride in Salt Spray Environment
Received:November 16, 2022  Revised:November 29, 2022
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DOI:10.7643/issn.1672-9242.2023.07.018
KeyWord:copper metallized AlN  salt spray  thermal conductivity coefficient  breakdown voltage  corrosion products  phonon-defect scattering
                                
AuthorInstitution
WANG Xuan Southwest Institute of Technology and Engineering, Chongqing , China
WU Hu-lin Southwest Institute of Technology and Engineering, Chongqing , China
LI Zhong-sheng Southwest Institute of Technology and Engineering, Chongqing , China
SONG Kai-qiang Southwest Institute of Technology and Engineering, Chongqing , China
CONG Da-long Southwest Institute of Technology and Engineering, Chongqing , China
HUANG An-wei Southwest Institute of Technology and Engineering, Chongqing , China
ZHANG Min Southwest Institute of Technology and Engineering, Chongqing , China
DING Xing-xing Southwest Institute of Technology and Engineering, Chongqing , China
PENG Dong Southwest Institute of Technology and Engineering, Chongqing , China
BAI Yi-xin Southwest Institute of Technology and Engineering, Chongqing , China
WEI Zi-xiang Southwest Institute of Technology and Engineering, Chongqing , China
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Abstract:
      The work aims to study the degradation behavior and the corresponding micro-mechanism of copper metallized AlN in salt spray environment. A total of 15 cycles of neutral salt spray experiment were carried out on copper metallized AlN by alternate spray and drying methods, and the relevant properties were tested at the 1st, 3rd, 6th, 10th and 15th cycles. The electrical insulation characteristics, dielectric loss and thermal conductivity of copper metallized AlN were evaluated by breakdown voltage test, dielectric property test and thermal conductivity test. The surface/section morphology and element change of the samples were analyzed by SEM and EDS. The thermal conductivity and breakdown voltage of copper metallized AlN gradually degraded with the salt spray experiment period, and the maximum degradation rates was 13.2% and 73.8%, respectively. The dielectric loss increased obviously, and the maximum value was about 1.3 in the low frequency region after 15 cycles. The Cu electrode was obviously corroded, producing a large number of green corrosion products, which led to the failure of Ni-P coating on the surface. H2O diffused into the AlN ceramics, causing ceramic hydrolysis in local areas and gradually forming microcracks. During the salt spray experiment, the Ni-P coating gradually crack and peel off, and a large area of loose porous corrosion product layer is finally formed on the surface of the Cu electrode. H2O, Cl–, Na+ gradually dissolve and diffuse into AlN ceramics, resulting in the increase of vacancy, crack and impurity defect concentration in ceramics. Both of them enhance the phonon-defect scattering in the process of thermal conductivity, which leads to the degradation of thermal conductivity of copper metallized AlN.
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