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| Method for Compiling Temperature Cycling Acceleration Load Spectra of Electronic Products in the Field Environment |
| Received:February 02, 2024 Revised:February 27, 2024 |
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| DOI：10.7643/issn.1672-9242.2024.04.009 |
| KeyWord:load spectrum two-dimensional load spectrum temperature load temperature cycle accelerated life test rain flow counting method probability density electronic products |
| Author | Institution |
| WU Yiqiao |
Naval Aviation University, Shandong Yantai , China |
| HAN Jianli |
Naval Aviation University, Shandong Yantai , China |
| LIU Xiaodi |
Naval Aviation University, Shandong Yantai , China |
| HE Zhenguang |
Unit 91599, Shandong Laiyang , China |
| LI Guanchen |
Army Staff Department of the PLA, Beijing , China |
| YU Kaize |
Unit 91423, Shandong Laiyang , China |
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| Abstract: |
| The work aims to compile the temperature load of electronic products with obvious daily fluctuation and seasonal difference in field environment into temperature cycle load spectrum and convert it into the acceleration load spectrum. The load cycle information in the original spectrum was extracted by the four-point rain flow counting method. The extracted cycle information was subject to statistical analysis such as distribution fitting and correlation testing, and a joint probability density function of cycle mean and range value was constructed. Then, the probability density method was used to compile 8 × 8 two-dimensional environmental load spectrum. On the basis of the two-dimensional load spectrum, a temperature cycle load spectrum was simultaneously developed and transformed into an acceleration load spectrum by an acceleration equation for electronic component parameter correction. Through the temperature record in a field operation cycle, a set of reasonable processes and solutions for compiling the temperature cycle load spectrum and converting it into the acceleration load spectrum were provided. This compiling method can utilize the vast majority of effective information from the original environmental spectrum to better reproduce the temperature changes experienced by electronic components during field operations, laying the foundation for accelerated life testing and service life prediction of electronic products. |
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