杨喜存,单军勇.某温湿高度试验箱低温-高度试验温度漂移原因分析与对策[J].装备环境工程,2014,11(1):101-104,110. YANG Xi-cun,SHAN Jun-yong.Analyzing the Causes of Temperature Excursion when Testing of Low Temperature-Altitude by a Temperature-Humidity-Altitude Testing Equipment and the Countermeasures[J].Equipment Environmental Engineering,2014,11(1):101-104,110.
某温湿高度试验箱低温-高度试验温度漂移原因分析与对策
Analyzing the Causes of Temperature Excursion when Testing of Low Temperature-Altitude by a Temperature-Humidity-Altitude Testing Equipment and the Countermeasures
投稿时间:2013-09-21  修订日期:2013-11-15
DOI:10.7643/issn.1672-9242.2014.01.020
中文关键词:  低温-高度试验  漂移  微电脑触摸屏编程  设备控制参数设置  参考数据
英文关键词:low temperature-altitude test  excursion  structure of sealing cover plate  parameter setting for equipment control  reference data
基金项目:
作者单位
杨喜存 西安电子工程研究所,西安710100 
单军勇 西安电子工程研究所,西安710100 
AuthorInstitution
YANG Xi-cun No.206Institute of China Ordnance Industry,Xi'an710100,China 
SHAN Jun-yong No.206Institute of China Ordnance Industry,Xi'an710100,China 
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中文摘要:
      目的针对某国产温湿高度试验箱,给出在低温-高度试验时,温度漂移的解决方法。方法在低温-高度试验时,对温度漂移原因进行研究分析,找出温度漂移的原因,给出了利用箱体微电脑触摸屏编程控制方法与设备控制参数设置的参考数据,找出了解决问题的简单方法。结果在低温(如-55℃)、低气压(如11.9kPa)阶段,温度波动小于±3℃。结论通过设备控制参数重置,特别是通过一种拟合编程摸底试验,成功地解决了低温-高度试验时温度漂移问题。试验结果满足试验技术条件要求,并且节约了人力物力,为产品的交付使用赢得了时间。
英文摘要:
      ObjectiveA temperature-humidity-altitude testing equipment was analyzed for solution of its temperature excursion during low temperature-altitude test. MethodsFor studying and analyzing the reason of temperature excursion during the low temperature-altitude test using a domestic temperature-humidity-altitude testing equipment,this paper found out the causes for temperature excursion during the low temperature-altitude test,and provided the recast method of the test hole’s sealing cover plate and the reference data of parameter setting for equipment control.ResultsTemperature change was smaller than ±3℃at low temperature(-55℃)and low air pressure(11.9 kPa). ConclusionWe have successfully solved the temperature excursion problem of low temperature-altitude test, through the device control parameter replacement,especially by a fitting program test. The test results met the requirements of test technology conditions,saved the manpower,and won time for product delivery.
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