目的 针对飞行器电子组件在复杂动载环境下BGA焊点易发生随机振动应力集中和冲击塑性应变累积的问题,提出一种面向BGA焊点阵列的振动-冲击响应预测与优化方法,以降低焊点阵列在典型动载工况下的综合危险响应。方法 以随机振动和冲击两类工况为牵引,建立包含PCB、15×15 BGA焊点阵列及周边器件的参数化模型,选取PCB厚度、焊点托起高度、焊点直径、焊盘直径及BGA焊点阵列x、y向偏移量作为设计变量,采用拉丁超立方采样生成300组样本。随机振动工况采用随机Mises应力,冲击工况采用等效塑性应变表征焊点塑性响应。进一步构建U-Net阵列响应代理模型,实现结构参数到15×15焊点阵列响应场的快速预测。在此基础上,以参考方案为基准,对随机振动最大随机Mises应力和冲击最大等效塑性应变进行归一化处理,构造1︰1加权的振动-冲击综合响应目标函数,并采用自适应反向学习螺旋搜索算法进行优化。结果 优化结果经有限元回代验证表明,冲击工况下BGA焊点阵列最大等效塑性应变降低40.31%,随机振动工况下最大随机Mises应力降低67.82%,综合目标函数降低54.07%,表明优化方案能够有效改善焊点阵列在2类动载工况下的响应水平。结论 所提方法能够在有限仿真样本条件下实现BGA焊点阵列振动-冲击响应快速预测与参数优化,有效降低2类典型动载工况下的焊点危险响应,可为飞行器电子组件复杂动载环境适应性设计和可靠性分析提供参考。
Abstract
The work aims to propose a vibration-shock response prediction and optimization method for BGA solder joint arrays to reduce the integrated critical response of the solder joint array under typical dynamic load cases, so as to address the problems of random-vibration-induced Mises stress concentration and shock-induced plastic strain accumulation in BGA solder joints of aircraft electronic assemblies under complex dynamic load environments. Driven by two load cases, random vibration and shock, a parametric model consisting of a PCB a 15×15 BGA solder joint array, and surrounding components was established. PCB thickness, solder joint stand-off height, solder joint diameter, pad diameter, and the x- and y-direction offsets of the BGA solder pad array were selected as design variables. A total of 300 samples were generated using Latin hypercube sampling. Random Mises stress was adopted for the random vibration case, while equivalent plastic strain was used to characterize the plastic response of solder joints under shock loading. A U-Net surrogate model for array responses was further constructed to rapidly predict the 15×15 solder joint array response field from structural parameters. Based on a reference design, the maximum random Mises stress under random vibration and the maximum equivalent plastic strain under shock loading were normalized, and a vibration-shock integrated objective function with equal weighting was formulated. The adaptive opposition-based spiral search algorithm was then employed for optimization. The finite element validation results showed that, after optimization, the maximum equivalent plastic strain of the BGA solder joint array under shock loading was reduced by 40.31%, the maximum random Mises stress under random vibration was reduced by 67.82%, and the integrated objective function was reduced by 54.07%. These results indicated that the optimized design could effectively improve the response level of the solder joint array under the two dynamic load cases. The proposed method enables rapid prediction and parameter optimization of vibration-shock responses of BGA solder joint arrays with limited simulation samples. It can effectively reduce the critical responses of solder joints under two typical dynamic load cases and provide a reference for environmental worthiness design and reliability analysis of aircraft electronic assemblies under complex dynamic load environments.
关键词
复杂动载 /
BGA焊点 /
随机振动 /
冲击响应 /
等效Mises应力 /
等效塑性应变 /
U-Net代理模型 /
响应优化
Key words
complex dynamic load /
BGA solder joint /
random vibration /
shock response /
equivalent Mises stress /
equivalent plastic strain /
U-Net surrogate model /
response optimization
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基金
国家自然科学基金（52505158）; 陕西省科技厅秦创原创新创业人才项目（QCYRCXM-2022-306）; 西安市科技计划关键核心技术攻关项目（2026JH-GJHXG-0020）
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