目的 以某导弹引信板为研究对象,提出一种振动-冲击复合载荷仿真工况的构建方法,并对其进行疲劳寿命预测。方法 首先对板上的PBGA封装微焊点进行等效简化建模,建立简化的整体有限元模型。在此基础上,借助Ansys Workbench平台开展多工况有限元仿真,重点系统对比分析单一随机振动载荷与振动-冲击复合载荷作用下引信板危险位置的力学响应及疲劳寿命特性。结果 引入瞬时冲击载荷后,PBGA和SOP这2种封装类型危险焊点的应力水平分别提高了9.1%和7%,其疲劳寿命降幅分别达到54.1%和44.8%。结论 本研究可为导弹引信板的抗振动、抗冲击结构优化设计、服役可靠性评估及疲劳寿命精准预测提供理论依据与工程支撑。
Abstract
The work aims to take a certain missile fuze board as the research object to propose a method for constructing simulation conditions of vibration-shock combined loads and perform fatigue life prediction on the board. First, equivalent simplified modeling was carried out for the PBGA micro-solder joints on the board, and a simplified global finite element model was established. On this basis, multi-condition finite element simulations were conducted using the Ansys Workbench platform, with a focus on systematically comparing and analyzing the mechanical responses and fatigue life characteristics at the dangerous locations of the fuze board under single random vibration loads and vibration-shock combined loads. After the introduction of instantaneous shock loads, the stress levels at the two critical solder joints, PBGA and SOP, increased by 9.1% and 7%, respectively, while their fatigue life reductions reached 54.1% and 44.8%, respectively. This study can provide a theoretical basis and engineering support for the anti-vibration and anti-shock structural optimization design, service reliability assessment, and accurate fatigue life prediction of missile fuze boards.
关键词
复合载荷 /
有限元仿真 /
动力学分析 /
焊点疲劳寿命 /
等效模型 /
引信板
Key words
combined load /
finite element simulation /
dynamic analysis /
fatigue life of solder joint /
equivalent model /
fuze board
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参考文献
[1] 段柳浠, 汪奕, 芮棽. 某导引头电子模块力学特性分析[J]. 电子机械工程, 2018, 34(5): 24-27.
DUAN L X, WANG Y, RUI C.Mechanical Characteristics Analysis for Electronic Module of a Seeker[J]. Electro-Mechanical Engineering, 2018, 34(5): 24-27.
[2] 高成, 高然, 黄姣英, 等. 板级GP101芯片的焊点可靠性仿真分析[J]. 电子元件与材料, 2021, 40(11): 1145-1150.
GAO C, GAO R, HUANG J Y, et al.Simulation Analysis of Solder Joint Reliability of Board-Level GP101 Chip[J]. Electronic Components & Materials, 2021, 40(11): 1145-1150.
[3] 黄硕. 功率半导体器件散热特性及可靠性数值模拟[D]. 哈尔滨: 哈尔滨理工大学, 2022.
HUANG S.Numerical Simulation of Heat Dissipation Characteristics and Reliability of Power Semiconductor Devices[D]. Harbin: Harbin University of Science and Technology, 2022.
[4] 曾燕萍, 张景辉, 朱旻琦, 等. 3D异构集成的多层级协同仿真[J]. 电子与封装, 2021, 21(10): 54-72.
ZENG Y P, ZHANG J H, ZHU M Q, et al.Multi-Level Co-Simulation of 3D Heterogeneous Integration[J]. Electronics and Packaging, 2021, 21(10): 54-72.
[5] 高超. 弯振复合载荷下板级组件焊点应力应变分析与优化[D]. 桂林: 桂林电子科技大学, 2021.
GAO C.Stress-strain Analysis and Optimization of Solder Joints in Board-level Assemblies Under Bending-vibration Combined Loads[D]. Guilin: Guilin University of Electronic Technology, 2021.
[6] 杜振宇, 王学智, 李康, 等. 防空导弹起落架结构振动特性仿真分析[J]. 导弹与航天运载技术, 2017(5): 84-88.
DU Z Y, WANG X Z, LI K, et al.Simulation Analysis on Vibration Characteristics of Landing Gear of Air Defence Missile[J]. Missiles and Space Vehicles, 2017(5): 84-88.
[7] 郭晓君, 宋桂珍, 扶肖肖, 等. 某机载构件的轻量化设计与研究[J]. 机械设计与制造, 2021(11): 237-241.
GUO X J, SONG G Z, FU X X, et al.Lightweight Design and Research of an Airborne Component[J]. Machinery Design & Manufacture, 2021(11): 237-241.
[8] 晁征, 蒋书波, 张广明, 等. 高超声速导弹随机振动响应分析[J]. 装备环境工程, 2023, 20(2): 50-56.
CHAO Z, JIANG S B, ZHANG G M, et al.Random Vibration Response of Hypersonic Missile[J]. Equipment Environmental Engineering, 2023, 20(2): 50-56.
[9] LIU F, LU Y, WANG Z, et al.Numerical Simulation and Fatigue Life Estimation of BGA Packages under Random Vibration Loading[J]. Microelectronics Reliability, 2015, 55(12): 2777-2785.
[10] DING Y, TIAN R Y, WANG X L, et al.Coupling Effects of Mechanical Vibrations and Thermal Cycling on Reliability of CCGA Solder Joints[J]. Microelectronics Reliability, 2015, 55(11): 2396-2402.
[11] CHEN Y S, WANG C S, YANG Y J.Combining Vibration Test with Finite Element Analysis for the Fatigue Life Estimation of PBGA Components[J]. Microelectronics Reliability, 2008, 48(4): 638-644.
[12] SAMAVATIAN M, ILYASHENKO L K, SURENDAR A, et al.Effects of System Design on Fatigue Life of Solder Joints in BGA Packages under Vibration at Random Frequencies[J]. Journal of Electronic Materials, 2018, 47(11): 6781-6790.
[13] 李剑峰, 肖明清, 董佳岩, 等. 随机振动载荷下板级焊点失效模式分析[J]. 微电子学, 2018, 48(4): 555-559.
LI J F, XIAO M Q, DONG J Y, et al.Failure Mode Analysis of Board-Level Solder Joint with Random Vibration Load[J]. Microelectronics, 2018, 48(4): 555-559.
[14] 朱襄宁. 随机振动环境下电子封装结构动力学等效建模与疲劳寿命评估[D]. 大连: 大连理工大学, 2025.
ZHU X N.Dynamic Equivalent Modeling and Fatigue Life Evaluation of Electronic Packaging Structure under Random Vibration Environment[D]. Dalian: Dalian University of Technology, 2025.
[15] STEINBERG D S.Vibration Analysis for Electronic Equipment[M]. 2nd ed. John Wiley & Sons, 1978.
[16] 刘振. 冲击载荷作用下芯片封装的板级-整机可靠性研究[D]. 长沙: 中南大学, 2022.
LIU Z.Study on Board Level-Product Level Reliability of Chip Packaging under Drop Impact[D]. Changsha: Central South University, 2022.
[17] CHUNG S, KWAK J B.Comparative Study on Reliability and Advanced Numerical Analysis of BGA Subjected to Product-Level Drop Impact Test for Portable Electronics[J]. Electronics, 2020, 9(9): 1515.
[18] YU Q, KIKUCHI H, IKEDA S, et al.Dynamic Behavior of Electronics Package and Impact Reliability of BGA Solder Joints[C]//Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems. San Diego: IEEE, 2002.
[19] 李亚璘, 欧阳光耀. 分配电箱冲击试验与数值仿真[J]. 中国舰船研究, 2011, 6(4): 34-36.
LI Y L, OUYANG G Y.Shock Test and Simulation of Distribution Box[J]. Chinese Journal of Ship Research, 2011, 6(4): 34-36.
[20] ZHU Z H, MENG Q Q.Analysis on Random Vibration and Impact Response of Vehicle-Borne Electronic Chassis[C]//Proceedings of the 8th International Conference on Advances in Construction Machinery and Vehicle Engineering. Singapore: Springer, 2024: 1281-1296.
[21] 王鑫. 电子封装微焊点层等效建模方法及其在BGA焊点寿命预测中的应用[D]. 西安: 西安电子科技大学, 2023.
WANG X.Equivalent Modeling Method of Micro-Solder Joint Layer in Electronic Packaging and Its Application in Fatigue Life Prediction of BGA Solder Joint[D]. Xi'an: Xidian University, 2023.
[22] 黄志新刘成柱. ANSYS Workbench 14.0超级学习手册[M]. 北京: 人民邮电出版社, 2013.
HUANG Z X, LIU C Z.ANSYS Workbench 14.0 Super Learning Manual[M]. Beijing: Posts & Telecom Press, 2013.
[23] QI H Y, GANESAN S, OSTERMAN M, et al.Accelerated Testing and Finite Element Analysis of PBGA under Multiple Environmental Loadings[C]//Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability. Shanghai: IEEE, 2004: 99-106.
[24] 游忠友, 谢腾, 王海坤, 等. 舰载电柜的冲击响应研究[J]. 装备环境工程, 2025, 22(12): 68-77.
YOU Z Y, XIE T, WANG H K, et al.Shock Response of Shipborne Electrical Cabinets[J]. Equipment Environmental Engineering, 2025, 22(12): 68-77.
[25] CHOPRA A K.Dynamics of Structures: Theory and Applications to Earthquake Engineering[M]. 6th ed. London: Pearson Education Limited, 2023.
[26] LALANNE C.Mechanical Vibration and Shock Analysis, Volume 2: Sinusoidal Vibration[M]. 3rd ed. Hoboken, New Jersey: John Wiley & Sons, 2014.
[27] 牛强. 典型结构在单轴与三轴随机振动下的动力学响应对比分析[D]. 西安: 西安电子科技大学, 2014.
NIU Q.Comparative Analysis of Dynamic Response of Typical Structures under Uniaxial and Triaxial Random Vibration[D]. Xi'an: Xidian University, 2014.
[28] 汤大赟. 无铅BGA焊点的随机振动可靠性及其失效分析[D]. 镇江: 江苏科技大学, 2013.
TANG D B.The Reliability of Lead-Free BGA Balls and Failure Analysis under Random Vibration[D]. Zhenjiang: Jiangsu University of Science and Technology, 2013.
[29] LI J, QIU Y Y, WANG H D, et al.Evaluation of the Methods for Estimating the Fully Reversed Unnotched Fatigue Limits of Steels[J]. Advances in Materials Science and Engineering, 2019, 2019: 4098623.
[30] 李彬. PCBA组件回流焊工艺及多物理场可靠性分析[D]. 西安: 西安电子科技大学, 2024.
LI B.Reflow Soldering Process and Multi-Physics Field Reliability Analysis of PCBA Components[D]. Xi'an: Xidian University, 2024.
[31] ASTM International.ASTM B32-20 Standard Specification for Solder Metal[S]. West Conshohocken: ASTM International, 2020
[32] 郑修麟. 金属疲劳的定量理论[M]. 西安: 西北工业大学出版社, 1994.
ZHENG X L.Quantitative Theory of Metal Fatigue[M]. Xi'an: Northwestern Polytechnical University Press, 1994.
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