卫星精密器件冲击试验与仿真研究

陈夜; 郑鸣轩; 朱孔军; 金磊; 彭海阔; 冯彦军

doi:10.7643/issn.1672-9242.2026.07.015

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装备环境工程 ›› 2026, Vol. 23 ›› Issue (7) : 154-160. DOI: 10.7643/issn.1672-9242.2026.07.015

航空航天装备

卫星精密器件冲击试验与仿真研究

陈夜¹, 郑鸣轩¹, 朱孔军², 金磊¹, 彭海阔¹, 冯彦军¹

作者信息 +

Shock Response Test and Simulation for Satellite Fine Component

CHEN Ye¹, ZHENG Mingxuan¹, ZHU Kongjun², JIN Lei¹, PENG Haikuo¹, FENG Yanjun¹

Author information +

文章历史 +

摘要

目的探索瞬时、高量级的火工品解锁冲击给卫星精密器件带来的损伤风险。方法采用宏观试验与精确建模相结合的方法,对卫星内部精密器件的冲击响应进行分析。设计火工品解锁冲击试验系统,得出冲击作用的跨界面传递规律,进而获取单机外部壳体上的冲击响应。以单机内部的芯片与基板为对象,建立精确有限元模型,将单机壳体上实测的冲击响应作为载荷条件开展冲击响应谱分析,研究芯片与基板上的力学响应。结果试验测量了冲击在传递路径上的响应,发现冲击加速度在卫星结构上衰减迅速,传递到单机壳体后不足6 000 m/s²。仿真得出了单机内部器件的冲击响应,最小强度裕度位置发生在芯片引脚,裕度为2.57,满足强度裕度大于0的要求。结论本次火工品冲击作用经多界面传递后大幅衰减,不会造成芯片结构损伤。

Abstract

The work aims to explore the damage risk of satellite precision components caused by instantaneous, high-magnitude shock of pyrotechnic device unlocking. The shock response of these components was analyzed by combining macroscopic experiments with mesoscopic modeling. A pyrotechnic device unlocking shock test system was designed to obtain the cross-interface transmission laws of the shock, as well as the shock response on the external housing of the electronic unit. A mesoscopic finite element model was established for the internal chip and substrate. Using the shock response measured on the unit housing as load conditions, a shock response spectrum analysis was conducted to investigate the mechanical response of the chip and substrate. Experimental measurements of the response along the transmission path revealed that shock acceleration attenuated rapidly within the satellite structure, dropping to less than 6 000 m/s² upon reaching the unit housing. Simulation results regarding the shock response of internal components indicated that the location with the minimum strength margin was the chip pin. With a margin of 2.57, the component met strength requirements of a margin greater than zero. The shock from the pyrotechnic device attenuates significantly across multiple interfaces,and it will not cause damage to the chip structures.

导出引用

陈夜, 郑鸣轩, 朱孔军, 金磊, 彭海阔, 冯彦军. 卫星精密器件冲击试验与仿真研究[J]. 装备环境工程. 2026, 23(7): 154-160 https://doi.org/10.7643/issn.1672-9242.2026.07.015

CHEN Ye, ZHENG Mingxuan, ZHU Kongjun, JIN Lei, PENG Haikuo, FENG Yanjun. Shock Response Test and Simulation for Satellite Fine Component[J]. Equipment Environmental Engineering. 2026, 23(7): 154-160 https://doi.org/10.7643/issn.1672-9242.2026.07.015

中图分类号： V414.1

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